Laser Wafer Cutting

Solar Cell Cutting Machine

Our State of art laser solution for solar cell scribing & cutting with a more stable performance. The machine features the latest technology support so as to provide lasting work support for new generation High Power Laser Cutting machines, for precise solar cell metal cutting. The Solar Cell has two variations based on beam generation and transmission Fiber Lasers and Diode Lasers. Further, these laser scribing-dicing machines find use in the photovoltaic industry where these are used for scribing polycrystalline and mono- crystalline silicon wafers, and non-crystalline silicon solar cells. Its structural construction is rigid and heavy for vibration-free and high-accuracy scribing & cutting applications.

Building a Reliable Technical Experience

Product Description The machine features the latest technology support so as to provide lasting work support by for New generation High Power Laser Cutting machines, with high precision solar cell metal cutting.

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The Key to Light Performance

World’s best high-speed fiber laser forming machines with precise and accurate processing for all your business requirements such as metal sheet cutting, welding, cleaning, marking etc.

Stable and automated continuous process

Automation in the Solar cell cutting machine has changed the scenario of the production industry. The machine is very stable, utilizes very low electricity, and automatically processes the solar cell metal chips which have made it possible to have an uninterrupted production flow.

Precise cut operations

The Solar Cell Cutting machine executes the operation in the fluidic way and allow the cells to get perfectly cut at exactly required measurements.

Strong and easy structure for industrial applications

The structural construction of the machine is rigid and vibration-free and effective for cutting applications. The machine also includes vacuum plates, which do not have any potential for errors in solar cell breakdown.

Focus on safety

Extreme safety standards are considered while making this machine to eliminate hazardous situations at facilities and keep the machine operators as safe and secure as possible.

Laser Fiber Laser

Frame Design Compact

Laser Wavelength 1064nm

Transverse Mode TEM oo

Beam Quality M² < 1.8

Average Power 20 W / 30 W / 50 W

Resolution 1 micron

Line width < 30 micron

Repeatability ≤3 micron

Max. Scribing Speed 200* mm / sec

Laser Repetition Freq. 20 KHz to 80 KHz

Axis 175 x 175 mm / 312 x 312 mm

Controller PC Based

Cooling Air Cooled

Dimension 1300 x 1125 x 1450 mm

Connected Lode 230 V / 50 Hz, 0.46 kW

Camera In-Built

Z Axis Manual

Solar Cell Cutting Machine

Wafer Cutting

Brief Description

Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing

Features:

1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation

2. The reliable and high-precision X-Y-Z-θ worktable and excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system

3. Through vacuum absorption, the wafer cannot move during platform moving

4. The wafer can be positioned through positioning the Mark point on the wafer, which can ensure the cutting precision

5. The high-efficient and flexible software operation system has a simple and concise interface

6. Automatic loading and unloading, robot carrying and automatic edge searching function

Specification:

Machine

Laser power 15W 15W

Laser wavelength 355nm 355nm

XY axis repeated positioning precision ±1µm ±1µm

θ axis repeated positioning precision ±15s ±15s

Cutting line width >15µm >15µm

Cutting depth >25µm >25µm

Cutting speed (*The cutting speed varies from different products) 100mm/s 100mm/s

Loading and unloading mode Manual Robot carrying; automatic edge searching

Processing product type 2 inch-12 inch wafers 2 inch-12 inch wafers

Power supply AC 220V，50Hz AC 220V，50Hz

Wafer Cutting

PCBA Cutting Machine

Brief Description

1. With high-performance UV laser and self-developed control software.

2. With the high-precision motion platform system and high-precision galvanometer scanner.

3. With high-precision CCD positioning system.

Product Characteristics:

1. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product

2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing

3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high

4. The high-precision CCD positioning system can ensure the product’s processing precision.

Application Field:

1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP

2. Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials

3. Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip.

Equipment parameters

Machine

Control system square head + control card, Windows 7

Final processing repeated positioning precision ±0.02mm

Max. processing area 300mm*300mm

Camera positioning system 5MP

Support file format Dxf, plt and so on

Overall dimension (for reference) 1060*1000*1850mm

Power supply 220V, 50Hz, 6kW

Laser

Wavelength 355nm

Power 10W/15W

Min. line width 0.03mm

Fθ lens Box：50*50mm

Cooling mode Water cooling

2D platform

Stroke 400mm*300mm

Repeated positioning precision ±0.002mm

Software Dedicated software for solar cell cutting application

PCBA Cutting Machine